TSMC’s 5nm process is reportedly developing at a rapid pace in the lead up to mass production next year, outperforming even the company’s ramp up to 7nm chip production. Yields are reportedly over 50% for TSMC’s upcoming process node – every other chip on a wafer is functional and fit for purpose – and AMD’s Zen 4 CPUs are expected to be among the first in line for capacity.
The 5nm process node is reportedly well on its way to volume production, China Times reports (via Sweclockers). The node has been touted by TSMC as offering logic density 1.8 times that of the 7nm process, and running 20% faster or with less power than its predecessor. That should make it a dab hand for future processors looking for a healthy performance bump.
AMD is one such company eyeing up the 5nm node, which is expected to mature enough for mass production sometime in the first half of 2020. That should give AMD enough time to tape out designs and begin manufacturing its next-gen Ryzen processors utilising its Zen 4 architecture ready for launch sometime in 2021.
Apple and Huawei are also expected to be some of the first to manufacture processors, reportedly A14 and Kirin 1000 chips, on TSMC’s 5nm process alongside AMD.
Before that day comes, there’s still the matter of Zen 3 and Ryzen 4000 processors.
Set to launch next year, AMD’s next-gen processors are already out of the design stage, and will reportedly encompass “an entirely new architecture” from the Zen 2 processors currently reigning over our best CPU for gaming guide.
The Taiwanese mega-fab’s 7nm production got off to a great start, and has swiftly become the pure-play foundry’s most popular node for all chip manufacturing in 2019. With Ryzen 3000 processors and AMD Navi GPUs, such as the RX 5700 series and RX 5500 series, now available to purchase, even our humble gaming PCs are powered the company’s advanced process.
And if 5nm wasn’t tiny enough, TSMC is set to kick off 3nm process manufacturing in 2022, reports DigiTimes. In a seemingly never-ending march towards quantum tunneling and silicon that doesn’t work right, TSMC’s rapid advanced node adoption – and perhaps blasé node nomenclature – is just another blow to its rivals, Samsung and Intel.
Images courtesy of the Taiwan Semiconductor Manufacturing Co., Ltd.
- TSMC ramped 7nm from “zero wafers to full production in just over a month”
- AMD CPU shortage “wasn’t a TSMC issue,” but it will take Apple’s wafers just in case
- TSMC’s new EUV process is hitting yield just in time for AMD’s next-gen Zen 3 CPUs
- Future AMD chip production may be under threat as TSMC triples lead times for 7nm
- TSMC teases new AMD Zen 3 chiplet packaging details “in the coming months”