Intel and TSMC CEO’s needle each other over US based chipmaking

The world of chipmaking is a complex one. It’s clear the pressure is building from everyone including gamers hoping to grab affordable GPUs to big tech CEOs to politicking politicians. Discussions involving billions of dollars’ worth of contracts are usually kept in house, but that hasn’t stopped Intel CEO Pat Gelsinger and TSMC chairman Mark Liu from getting into a rare public spat over little things like geopolitical instability and national security.

Firstly, a bit of background. US lawmakers are working on passing legislation known as the CHIPS for America Act and the FABS Act. These bills aim to shore up USA based semiconductor R&D and manufacturing. Discussions have cited national security as a primary concern. The US Senate passed funding for the CHIPS act in June 2021, but since then discussions have stalled in the House of Representatives. The CEOs of Apple, Intel, Nvidia and AMD among many others have signed an open letter addressed to Congress pushing it to pass the legislation.  These calls for action will only get louder.

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(Image credit: Future)

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